Product Description
1. High temperature resistance: The melting point of quartz (SiO₂) is about 1700°C. It can work stably for a long time at high temperatures of 1200°C~1500°C without softening or deformation.
2. Chemical inertness: It does not react with acids (except hydrofluoric acid), alkalis or organic solvents to avoid contaminating materials. It is especially suitable for processing high-purity materials (such as semiconductor silicon wafers and photovoltaic materials).
3. Mechanical properties: It has high hardness (Mohs hardness 7) and strong wear resistance, making it suitable as a grinding medium; but it is brittle and needs to avoid severe impact.
4. Thermal stability: Low thermal expansion coefficient (about 0.5×10⁻⁶/°C), excellent thermal shock resistance, and can withstand rapid temperature rise and fall processes.
1. Semiconductor manufacturing: used for silicon wafer polishing and silicon carbide powder grinding to avoid metal contamination.
2. Optical material processing: high-transmittance quartz balls are used as laser cavity reflection media or lens molding molds.
3. Special ceramic preparation: grinding high-performance ceramic powders such as alumina and silicon nitride to increase sintering density.
4. New energy field: wet or dry dispersion grinding of lithium battery materials (such as positive electrode materials).
5. High-temperature industry: used as heat field support balls or heat transfer media in quartz tube furnaces and vacuum sintering furnaces.
